4401.39.00 | 20 | Fuel wood, in logs, in billets, in twigs, in faggots or in similar forms; wood in chips or particles; sawdust and wood waste and scrap, whether or not agglomerated in logs, briquettes, pellets or similar forms. - Sawdust and wood waste and scrap, whether or not agglomerated in logs, briquettes, pellets or similar forms: - Other - Firelogs, of agglomerated sawdust | KGM | Free | CCCT, LDCT |
4401.39.00 | 30 | Fuel wood, in logs, in billets, in twigs, in faggots or in similar forms; wood in chips or particles; sawdust and wood waste and scrap, whether or not agglomerated in logs, briquettes, pellets or similar forms. - Sawdust and wood waste and scrap, whether or not agglomerated in logs, briquettes, pellets or similar forms: - Other - Shavings | KGM | Free | CCCT, LDCT |
4401.39.00 | 90 | Fuel wood, in logs, in billets, in twigs, in faggots or in similar forms; wood in chips or particles; sawdust and wood waste and scrap, whether or not agglomerated in logs, briquettes, pellets or similar forms. - Sawdust and wood waste and scrap, whether or not agglomerated in logs, briquettes, pellets or similar forms: - Other - Other | KGM | Free | CCCT, LDCT |
5407.10.10 | 00 | Woven fabrics of synthetic filament yarn, including woven fabrics obtained from materials of heading 54.04.
- Woven fabrics obtained from high tenacity yarn of nylon or other polyamides or of polyesters - Belting, of a thickness not exceeding 2.8 mm and a width exceeding 350 mm, of nylon, polyester or aramid, for use in the manufacture of conveyor belts;For use in the manufacture of goods of Section XVI, of Chapter 40, 73 or 90, or of heading 59.10 or 87.05 (excluding the motor vehicle chassis portion and parts thereof), such goods being used in the exploration, discovery, development or operation of potash or rock salt deposits;For use in the manufacture of insignia for sails for ships or boats;For use in the manufacture of sails for ships or boats;Transmission belting, excluding belting of trapezoidal cross-section (V or multi V), whether or not embossed, for use in the manufacture of transmission belts | KGM | Free | LDCT, GPT, |
44.10 | | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. | | | |
4410.11 | | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Particle board | | | |
4410.11.10 | 00 | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Particle board - Unworked or not further worked than sanded;
Whether or not painted, edge or face worked, but not otherwise worked or surface covered | MTQ | Free | CCCT, LDCT |
4410.11.90 | | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Particle board - Other | MTQ | Free | CCCT, LDCT |
4410.11.90 | 11 | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Particle board - Other - Surface-covered with decorative laminates of plastics: - With polymers of vinyl | MTQ | Free | CCCT, LDCT |
4410.11.90 | 19 | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Particle board - Other - Surface-covered with decorative laminates of plastics: - Other | MTQ | Free | CCCT, LDCT |
4410.11.90 | 90 | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Particle board - Other - Other | MTQ | Free | CCCT, LDCT |
4410.12.00 | 00 | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Oriented strand board (OSB) | MTQ | Free | CCCT, LDCT |
4410.19 | | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Other | | | |
4410.19.10 | 00 | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Other - Unworked or not further worked than sanded;
Waferboard;
Whether or not painted, edge or face worked, but not otherwise worked or surface covered | MTQ | Free | CCCT, LDCT |
4410.19.90 | | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Other - Other | MTQ | Free | CCCT, LDCT |
4410.19.90 | 11 | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Other - Other - Surface-covered with decorative laminates of plastics: - With polymers of vinyl | MTQ | Free | CCCT, LDCT |
4410.19.90 | 19 | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Other - Other - Surface-covered with decorative laminates of plastics: - Other | MTQ | Free | CCCT, LDCT |
4410.19.90 | 90 | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Of wood: - Other - Other - Other | MTQ | Free | CCCT, LDCT |
4410.90.00 | | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Other | MTQ | Free | CCCT, LDCT |
4410.90.00 | 10 | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Other - Whether or not painted, edge or face-worked, but not otherwise worked or surface covered | MTQ | Free | CCCT, LDCT |
4410.90.00 | 90 | Particle board, oriented strand board (OSB) and similar board (for example, waferboard) of wood or other ligneous materials, whether or not agglomerated with resins or other organic binding substances. - Other - Other | MTQ | Free | CCCT, LDCT |
4411.92.10 | | Fibreboard of wood or other ligneous materials, whether or not bonded with resins or other organic substances. - Other: - Of a density exceeding 0.8 g/cm³ - Not mechanically worked or surface covered;
Resin impregnated, containing 17% or more by weight of phenol-formaldehyde resin, for use in the manufacture of overlaid plywood or overlaid particle board | KGM | Free | CCCT, LDCT |
4411.92.10 | 11 | Fibreboard of wood or other ligneous materials, whether or not bonded with resins or other organic substances. - Other: - Of a density exceeding 0.8 g/cm³ - Not mechanically worked or surface covered;
Resin impregnated, containing 17% or more by weight of phenol-formaldehyde resin, for use in the manufacture of overlaid plywood or overlaid particle board - Not mechanically worked or surface covered: - Doorskins | KGM | Free | CCCT, LDCT |
4411.92.10 | 19 | Fibreboard of wood or other ligneous materials, whether or not bonded with resins or other organic substances. - Other: - Of a density exceeding 0.8 g/cm³ - Not mechanically worked or surface covered;
Resin impregnated, containing 17% or more by weight of phenol-formaldehyde resin, for use in the manufacture of overlaid plywood or overlaid particle board - Not mechanically worked or surface covered: - Other | KGM | Free | CCCT, LDCT |
4411.92.10 | 21 | Fibreboard of wood or other ligneous materials, whether or not bonded with resins or other organic substances. - Other: - Of a density exceeding 0.8 g/cm³ - Not mechanically worked or surface covered;
Resin impregnated, containing 17% or more by weight of phenol-formaldehyde resin, for use in the manufacture of overlaid plywood or overlaid particle board - Resin impregnated, containing 17% or more by weight of phenol-formaldehyde resin, for use in the manufacture of overlaid plywood or overlaid particle board: - Doorskins | KGM | Free | CCCT, LDCT |