| 8541.40.60 | 20 | Assembled into modules or made up into panels | No. | | | |
| 8541.40.70 | | Transistors | | Free | | 35% |
| 8541.40.70 | 40 | Unmounted chips, dice and wafers | No. | | | |
| 8541.40.80 | 00 | Optical coupled isolators | No. | Free | | 35% |
| 8541.50.00 | | Other semiconductor devices | | Free | | 35% |
| 8541.50.00 | 40 | Unmounted chips, dice and wafers | No. | | | |
| 8541.60.00 | | Mounted piezoelectric crystals | | Free | | 35% |
| 8541.60.00 | 10 | Quartz designed for operating frequencies of: | | | | |
| 8541.60.00 | 20 | Not exceeding 1 MHz, except 32.768 kHz | No. | | | |
| 8541.60.00 | 30 | Exceeding 1 MHz, but not exceeding 5 MHZ | No. | | | |
| 8541.60.00 | 50 | Exceeding 5 MHZ, but not exceeding 20 MHz | No. | | | |
| 8541.60.00 | 60 | Exceeding 20 MHZ | No. | | | |
| 8542 | | Electronic integrated circuits; parts thereof: | | | | |
| 8542.31.00 | 00 | Electronic integrated circuits: | | | | |
| 8542.31.00 | 00 | Processors and controllers, whether or not combined with memories, converters, logic circuits, amplifiers, clock and timing circuits, or other circuits | No. | Free | | 35% |
| 8542.32.00 | | Memories: | | Free | | 35% |
| 8542.32.00 | 01 | Dynamic read-write random access: | | | | |
| 8542.32.00 | 01 | Not over 128 megabits | No. | | | |
| 8542.32.00 | 20 | Over 128 megabits but not over 256 megabits | No. | | | |
| 8542.32.00 | 21 | Over 256 megabits but not over 512 megabits | No. | | | |
| 8542.32.00 | 22 | Over 512 megabits but not over 1 gigabit | No. | | | |
| 8542.32.00 | 23 | Over 1 gigabit | No. | | | |
| 8542.32.00 | 40 | Static read-write random access (SRAM) | No. | | | |
| 8542.32.00 | 50 | Electrically erasable programmable read-only memory (EEPROM) | No. | | | |
| 8542.32.00 | 60 | Erasable (except electrically) programmable read-only memory (EPROM) | No. | | | |
Harmonized Tariff Schedule of the United States inquiry: 3203Ã
