| 8531.80.00 | 50 | Other | X | | | |
| 8531.90 | | Parts: | | | | |
| 8531.90.15 | 00 | Printed circuit assemblies: | | | | |
| 8531.90.15 | 00 | Of the panels of subheading 8531.20 | X | Free | | 35% |
| 8531.90.30 | 00 | Other | X | 1.3% | Free (A,AU,B,BH, CA,CL,E,IL,J,JO, MA,MX,P,SG) | 35% |
| 8531.90.75 | 00 | Other: | | | | |
| 8531.90.75 | 00 | Of the panels of subheading 8531.20 | X | Free | | 35% |
| 8531.90.90 | 00 | Other | X | 1.3% | Free (A,AU,B,BH, CA,CL,E,IL,J,JO, MA,MX,P,SG) | 35% |
| 8532 | | Electrical capacitors, fixed, variable or adjustable (pre-set); parts thereof: | | | | |
| 8532.10.00 | 00 | Fixed capacitors designed for use in 50/60 Hz circuits and having a reactive power handling capacity of not less than 0.5 kvar (power capacitors) | No. | Free | | 35% |
| 8532.21.00 | | Other fixed capacitors: | | | | |
| 8532.21.00 | | Tantalum | | Free | | 35% |
| 8532.21.00 | 20 | Metal case | No. | | | |
| 8532.21.00 | 40 | Other: | | | | |
| 8532.21.00 | 40 | Dipped | No. | | | |
| 8532.21.00 | 50 | Designed for surface mounting (SMD) by contact | No. | | | |
| 8532.21.00 | 80 | Other | No. | | | |
| 8532.22.00 | | Aluminum electrolytic | | Free | | 35% |
| 8532.22.00 | 20 | Not exceeding 18 mm in diameter | No. | | | |
| 8532.22.00 | 40 | Exceeding 18 mm but not exceeding 35 mm in diameter | No. | | | |
| 8532.22.00 | 55 | Exceeding 35 mm but not exceeding 51 mm in diameter | No. | | | |
| 8532.22.00 | 85 | Exceeding 51 mm in diameter | No. | | | |
| 8532.23.00 | | Ceramic dielectric, single layer | | Free | | 35% |
| 8532.23.00 | 20 | Chips | No. | | | |
| 8532.23.00 | 40 | Other: | | | | |
Harmonized Tariff Schedule of the United States inquiry: 3203Ã
