| 6302.51.10 | 00 | Damask (369) | No. kg | 6.1% | Free (BH,CA, CL,IL,JO, MX,P,SG) 1.8% (MA) 5.5% (AU) | 30% |
| 6302.53.00 | 10 | Damask (666) | No. kg | | | |
| 6302.59.10 | 10 | Damask (899) | No. kg | | | |
| 7209.18.25 | 10 | Of a kind for use in making aperture masks for cathode-ray tube video displays | kg | | | |
| 7211.23.60 | 75 | Of a kind for use in making aperture masks for cathode-ray tube video displays | kg | | | |
| 7225.50.80 | 15 | Of a kind for use in making aperture masks for cathode-ray tube video displays | kg | | | |
| 8486.40.00 | 10 | For the manufacture or repair of masks and reticles | No. | | | |
| 9020.00 | | Other breathing appliances and gas masks, excluding protective masks having neither mechanical parts nor replaceable filters; parts and accessories thereof: | | | | |
| 9020.00.60 | 00 | Other breathing appliances and gas masks | X | 2.5% | Free (A,AU,BH,C, CA,CL,E,IL,J,JO, MA,MX,P,SG) | 35% |
| 9031.41.00 | | For inspecting semiconductor wafers or devices or for inspecting photomasks or reticles used in manufacturing semiconductor devices | | Free | | 50% |
| 9031.41.00 | 20 | For inspecting photomasks or reticles used in manufacturing semiconductor devices | No. | | | |
| 9031.49.70 | 00 | For inspecting masks (other than photomasks) used in manufacturing semiconductor devices; for measuring surface particulate contamination on semiconductor devices | No. | Free | | 50% |
